Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Flip chip device assembly entails three basic steps: a die pick-up, an alignment and placement to the package/substrate footprint, and a final attachment or bonding step. For pick-up, die can be ...

The publication also noted that this Exynos chip is at a "flagship-level" as the company deployed it during a dual-chip ...

Vintage DEC computer enthusiast [Jay Logue] combines both of these in his recent project on GitHub, where he shares several KiCad templates for making your own Flip-Chip modules. Although named ...

Samsung has long marketed its foldables as high-end products with a premium price tag. However, rumors suggest that the ...

Samsung is set to launch an affordable version of its popular Galaxy Z Flip foldable phone in 2025, called the Galaxy Z Flip ...

Vintage DEC computer enthusiast [Jay Logue] combines both of these in his recent project on GitHub, where he shares several KiCad templates for making your own Flip-Chip modules. Although named ...