Until recently, the HVM-capable flip-chip bonders had alignment tolerances of ±3µm (3 sigma), but that has been driven down to 1µm (3 sigma). “A rule of thumb for alignment accuracy is that the bonder ...

We remain confident of winning more orders for our next-generation hybrid bonders in the quarters ahead ... they basically move completely from flip-chip to TCB for chip-to-wafer?

They say these efforts have boosted optical semiconductor bonding speed to 6,000 units per minute,, compared with around four units per minute with conventional flip chip bonders. Toray previously ...

The latest rumor comes from the leaker Jukanlosreve on X (spotted by Android Police) who stated that the Fan Edition foldable ...

The die bonder equipment market is estimated to be worth US$ 4,415.3 million in 2023 and is set to surpass US$ 6,726.7 ...

The publication also noted that this Exynos chip is at a "flagship-level" as the company deployed it during a dual-chip ...

Samsung has long marketed its foldables as high-end products with a premium price tag. However, rumors suggest that the ...

In a post on X (formerly Twitter), tipster @Jukanlosreve suggests that a flagship processor could be used in the purported Samsung Galaxy Z Flip FE. It is said to be powered by the Exynos 2400 under ...

The OmniBook Ultra Flip 14 is no different. The base model with a Core Ultra 5 226V chipset, 16GB of RAM, a 512GB SSD, and the standard 14-inch 2.8K OLED display has a list price $1,450 but is ...