Semiconductor Packaging News6d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News6d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News6d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News6d
Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...
Semiconductor Packaging News7d
DENSO and onsemi Collaborate for a Strengthened Relationship
DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...
Semiconductor Packaging News7d
sureCore teams with Sarcina to package cryo chips
Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...
Semiconductor Packaging News7d
Good overall result and revenue growth for the ZEISS Group
ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...
Semiconductor Packaging News7d
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies ... SEMICON Japan opens at Tokyo Big ...
Semiconductor Packaging News2d
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...
Semiconductor Packaging News2d
Revolutionizing Memory: The Cutting-Edge Design Scheme Behind HBM3E's Success
The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...
Semiconductor Packaging News3d
US plans to blacklist company that ordered TSMC chip found in Huawei processor
The Biden administration plans to blacklist Sophgo, a Chinese company tied to Huawei's AI-chip supply chain, after discovering its TSMC-made chip was used in Huawei's Ascend 910B processor. Sophgo ...
Semiconductor Packaging News2d
Moore’s Law at 60: get the Intel on the next few decades
Summary Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...