Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.
Recap: Nvidia CEO Jensen Huang addressed concerns about the company's demand for advanced packaging from TSMC earlier this week, clarifying that while their technological needs are evolving ...
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said ...
More importantly, TSMC reported revenue growth of 58% and 34% in the final two months of 2024. As Nvidia's fiscal fourth quarter of 2025 coincides with these three months, there is a solid chance that ...
ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue ...
Nvidia’s RTX 50-series GPUs are just around the corner, with the first releases — the RTX 5090 and RTX 5080 — dropping on ...
TSMC management has indicated enormous AI opportunity for its foundry business, particularly for GPUs and ASICs. See why I ...
High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...
Despite the US's new tariff policy and other macroeconomic circumstances, TSMC is on track to boost its 2nm and advanced ...
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked ...
Tung said 75% will come from leading edge packaging and 25% from advanced testing. ASE’s subsidiary, Siliconware Precision Industries, has been a key supplier to Nvidia for the past 27 years.
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