Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...

GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

The US Department of Commerce has signed four separate non-binding preliminary memoranda of terms to award more than $246 ...

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...

Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...