Chip & Wire assembly involves the attachment of the die to a package or substrate followed by connecting wires from the die bond pads to the same package or substrate. Bell Laboratories originally ...

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

Wire Bonding A process used to electrically connect a die to a package via wire loops. The wire loops may be bonded by soldering or ultrasonic techniques. Flip Chip Technology Flip Chip is the method ...