Until recently, the HVM-capable flip-chip bonders had alignment tolerances of ±3µm (3 sigma), but that has been driven down to 1µm (3 sigma). “A rule of thumb for alignment accuracy is that the bonder ...

We remain confident of winning more orders for our next-generation hybrid bonders in the quarters ahead ... they basically move completely from flip-chip to TCB for chip-to-wafer?

They say these efforts have boosted optical semiconductor bonding speed to 6,000 units per minute,, compared with around four units per minute with conventional flip chip bonders. Toray previously ...

Samsung could be working on a budget flip phone, and a fresh leak hinted at the Galaxy Z Flip FE packing the Exynos 2400.

The publication also noted that this Exynos chip is at a "flagship-level" as the company deployed it during a dual-chip ...

The die bonder equipment market is estimated to be worth US$ 4,415.3 million in 2023 and is set to surpass US$ 6,726.7 million by 2033. The adoption of die bonder equipment is likely to rise at a CAGR ...

Please verify your email address. Rumors suggest Samsung may release affordable Galaxy Z Flip FE with Exynos 2400 chip next year. Samsung may equip next year's flagship foldables with Exynos 2500 ...

The OmniBook Ultra Flip 14 is no different. The base model with a Core Ultra 5 226V chipset, 16GB of RAM, a 512GB SSD, and the standard 14-inch 2.8K OLED display has a list price $1,450 but is ...

According to the latest rumors, Samsung might be working on a Galaxy Z Flip FE. Of course, that comes after leaks suggesting that the company is not working on the phone. It's hard to pin down ...

In the din of manufacturers rushing to bring look-a-like handheld gaming PCs to market, Ayaneo has struck a chord with the Flip DS ... upscaling is specified. The chip may be pretty familiar ...