Flip chip device assembly entails three basic steps: a die pick-up, an alignment and placement to the package/substrate footprint ... GelPak , a reel tape or a sawed wafer mounted on a film frame. The ...

However, in many instances a package is classified as a CSP if it is simply near-die size . CSPs share many of the same attributes as the flip chip including areas of application. When first ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...